精品国产sm最大网站起碰,久久丁香五月丁中文精品,做着做着就软了为什么,国产动漫精品一区二区三区

  • <sup id="j5e0r"></sup>

    1. Welcome:Beijing Plink Ai Technology Co.,LTD.Service Hotline:+86-400-127-3302
      Language: Chinese ∷  English

      NVIDIA Jetson Embedded Systems

      • Jetson Nano IPC SYS-2006
      • Jetson Nano IPC SYS-2006
      Jetson Nano IPC SYS-2006Jetson Nano IPC SYS-2006

      Jetson Nano IPC SYS-2006

      Jetson Nano IPC Nano-SYS-2006

      Feature

      * NVIDIA Jetson Carrier Board:

      Support NVIDIA Jetson Nano Module


      * Versatile Connectivity:
      Offer 1x RJ45, 2x USB 3.0, 1x USB 2.0, 1x HDMI and 1x USB Micro B


      * Advanced Peripherals Supported:
      Assemble 1x TF slot, 1x Nano SIM, 2 RS232, 3x GPIO, 1x GPO


      * Input Power: DC +9V~+24V


      * Compact and Durable duri
      ng Operation:
      Design in small size of 160mm*133mm*65mm to save operation space, and maintain function in the temperature range from -20°C to 65℃


      * Expansion:

      4G communication module, WIFI/Bluetooth module, Video capture/output module, Multi I/O module.


      Product Name

      Nano-SYS-2006

      Jetson Module Supported

      NVIDIA Jetson Nano

      AI Processor 472 GFLOPS
      GPU 128-core NVIDIA Maxwell? architecture GPU
      CPU Quad-Core Arm® Cortex®-A57 MPCore processor

      Memory

      4GB 64-bit LPDDR4
      25.6GB/s

      Storage

      16GB eMMC 5.1

      Video Encode

      1x 4K30 (H.265)
      2x 1080p60 (H.265)

      Video Decode
      1x 4K60 (H.265)
      4x 1080p60 (H.265)

      CSI Camera
      Up to 4 cameras
      12 lanes MIPI CSI-2
      D-PHY 1.1 (up to 18 Gbps)

      Networking
      1x Gigabit Ethernet(10/100/1000 BAST-T) RJ45
      USB
      2x USB 3.0 Type-A
      1x USB 2.0
      1x Micro USB

      Display

      1x HDMI

      Other I/O 1x Micro TF,1x Nano SIM,2x RS232,3x GPIO,1x GPO

      Mechanical

      160mm x 133mm x 65mm
      Weight 808g
      Operating Temperature
      -20℃~+65℃
      Power DC +9V~+24V



      Application

      * robots and robotics

      * face recognition
      * Unmanned boats/cars
      * Industrial automation and control systems
      * Digital signage and media players
      * IoT (Internet of Things) and embedded systems

      * Education and prototyping projects