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    1. Welcome:Beijing Plink Ai Technology Co.,LTD.Service Hotline:+86-400-127-3302
      Language: Chinese ∷  English

      NVIDIA Jetson Developer System

      • Y-C17-DEV Developer System
      • Y-C17-DEV Developer System
      • Y-C17-DEV Developer System
      Y-C17-DEV Developer SystemY-C17-DEV Developer SystemY-C17-DEV Developer System

      Y-C17-DEV Developer System

      Board size:85mm*63mm*35mm
      Power input: DC +12V ~ +24V
      Working temperature: -40 ~ +65℃
      Weight: 125g

      Y-C17-DEV is based on the Plink AI development system driven by NVIDIA Jetson Xavier? NX、NVIDIA Jetson ORIN? NX and NVIDIA Jetson ORIN? NANO modules. All the components on the board are of wide temperature type, the main interface is designed for electrostatic safety protection, and the power supply application scheme of high reliability is adopted. The input power supply has the functions of overvoltage and reverse polarity protection, and has a variety of external interfaces. It can also carry hundreds of functional modules through a MiniPCIe connector (including USB2.0 and PCIe X1 signals) to achieve further expansion of system functions. The M.2 B key slot of the Y-C17 carrier board can directly carry 4G/5G communication modules, and the carrier board has a Nano SIM card slot.


      2 x Type-Cconnector

      1 x NanotypeSIM card connector

      1 xfull lengthMiniPCIeconnector

      1 x M.22230M keyslot

      1 x M.2 3050 B keyslot(Expandable 4G/5G communication module)

      1 x 2 Lane MIPI camera interface FPC connector

      1 x 3.3V RTCpower supply port

      1 xFan control interface(5V)

      Automatic power on

      Anti-shedding power supply terminals

      Board size:85mm * 63mm * 35mm

      Power input: DC  +12V~+24V

      Working temperature: -40 ~ +65℃

      Weight: 125g



      NVIDIA Jetson Orin NX/NVIDIA Jetson Orin Nano module

      technical specification


      Jetson Orin NX 16GB
      Jetson Orin NX 8GB

      Jetson Orin Nano 8GB

      Jetson Orin Nano 4GB

      Jetson Xavier NX 16GB

      Jetson Xavier NX 8GB
      AI Perf
      100 TOPS
      70 TOPS
      40 TOPS
      20 TOPS
      21 TOPS

      GPU

      1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
      1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores
      512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores
      384-core NVIDIA Volta? architecture GPU with 48 Tensor Cores

      CPU

      8-core Arm® Cortex®-A78AE v8.2 64-bit CPU
      2MB L2 + 4MB L3
      6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
      1.5MB L2 + 4MB L3
      6-core Arm® Cortex®-A78AE v8.2 64-bit CPU
      1.5MB L2 + 4MB L3
      6-core NVIDIA Carmel Arm®v8.2 64-bit CPU
      6MB L2 + 4MB L3

      Memory

      16GB 128-bit LPDDR5
      102.4GB/s
      8GB 128-bit LPDDR5
      102.4GB/s
      8GB 128-bit LPDDR5
      68 GB/s
      4GB 64-bit LPDDR5
      34 GB/s
      16GB 128-bit LPDDR4x
      59.7GB/s
      8GB 128-bit LPDDR4x
      59.7GB/s

      Storage

      -
      (Supports external NVMe)
      16GB eMMC 5.1
      Video Encode
      1x 4K60 (H.265)
      3x 4K30 (H.265)
      6x 1080p60 (H.265)
      12x 1080p30 (H.265)
      1080p30 supported by 1-2 CPU cores
      2x 4K60 (H.265)
      4x 4K30 (H.265)
      10x 1080p60 (H.265)
      22x 1080p30 (H.265)

      Video Decode

      1x 8K30 (H.265)
      2x 4K60 (H.265)
      4x 4K30 (H.265)
      9x 1080p60 (H.265)
      18x 1080p30 (H.265)
      1x 4K60 (H.265)
      2x 4K30 (H.265)
      5x 1080p60 (H.265)
      11x 1080p30 (H.265)
      2x 8K30 (H.265)
      6x 4K60 (H.265)
      12x 4K30 (H.265)
      22x 1080p60 (H.265)
      44x 1080p30 (H.265)

      CSI Camera

      Up to 4 cameras (8 via virtual channels***)
      8 lanes MIPI CSI-2
      D-PHY 2.1 (up to 20Gbps)
      Up to 4 cameras (8 via virtual channels***)
      8 lanes MIPI CSI-2
      D-PHY 2.1 (up to 20Gbps)
      Up to 6 cameras
      (24 via virtual channels)
      14 lanes MIPI CSI-2
      D-PHY 1.2 (up to 30 Gbps)

      PCIe

      1 x4 + 3 x1
      (PCIe Gen4, Root Port, & Endpoint)
      1 x4 + 3 x1
      (PCIe Gen3, Root Port, & Endpoint)
      1 x4 (PCIe Gen4) + 1 x1 (PCIe Gen3)

      USB

      3x USB 3.2 Gen2 (10 Gbps)
      3x USB 2.0
      3x USB 3.2 Gen2 (10 Gbps)
      3x USB 2.0
      1x USB 3.2 Gen2 (10 Gbps)
      3x USB 2.0

      Power

      10W - 25W
      10W - 20W
      7W - 15W
      7W - 10W
      10W - 20W
      Mechanical 69.6mm x 45mm
      260-pin SO-DIMM connector